What is SML?

What is SML?...

A Sacrificial Metal Layer (SML) is used to interconnect die clusters on the wafer and provide an interface between the wafer and the test hardware. The SML is designed to make contact with the die power (core and I/O), the DFT interface and to provide multiplexed output monitoring. Several die are grouped into clusters which, via isolation resistors and fusible links, will share the same inputs. All passive components and cluster buss routing will be placed within the scribe lines on the wafer. The SML is placed above the wafer passivation layer and is added post wafer processing, typically in a bump facility. If the die are being manufactured as KGD the SML would be removed after testing has been completed.

In some instances active components for die output multiplexing may be designed into the active device layers for inclusion during the wafer processing.

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