What is Burn-In?

What is Burn-In?...

Burn-in is a test method used to stress integrated circuits (IC's) to provide a high level of performance reliability when included in completed assemblies. A number of IC's are loaded onto a test fixture which is mounted into a chamber capable of reaching stress temperatures of 150°C. All the IC's on the test fixture are exercised using stimulus vectors designed to maximize toggle rates. To date most burn-in has been performed on packaged devices as part of the back-end test process. The burn-in cycle allows for detection of early-life failures (ELF) and provides end of life data. During the burn-in cycle the devices are transferred to automated test systems (ATE) for electrical verification. As the industry moves towards a requirement for known-good-die (KGD) it is becoming necessary to find alternate methods of burn-in which can be used at the wafer level. This will ultimately lead to the burn-in step being integrated into the front-end test path, providing direct process control feedback to the foundries, allowing qualification data to be gathered and processed early in the design cycle, and will reduce the overall test cost associated with burning-in at the package level.

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Burn-In Services

Burn-in Services

Burn-in Fixturing